Abstract
The influence of the high-temperature annealing ambient, i.e., and Ar on size controlled Si nanocrystals (NCs) ranging from to embedded in has been investigated in detail. Generally, annealing is proven to be beneficial as the dangling bond density ( defects at the interface) is about half, accompanied by a doubled photoluminescence (PL) intensity. The PL blueshift of annealed samples compared to Ar-annealed samples (N-blueshift) was found to be pronounced only for small NCs whereas it appears to be insignificant for larger NCs. The origin of this N-blueshift was previously attributed to a growth suppression of the NCs by the presence of N during the annealing process. However, no evidence for this assumption is found by time-resolved PL, as the luminescence decay times are similar despite considerable N-blueshift. The exact location of the N incorporated during annealing was investigated by time-of-flight-SIMS and electron-spin resonance. Besides the distinct N enrichment in the NC layer, the center was detected indicating the formation of an interfacial N layer at the interface. Elastic recoil detection analysis enabled the quantification of the incorporated N as well as the excess Si. Combined with transmission electron microscopy analysis (determination of NC size) the calculation of the NC density per superlattice layer and the thickness of the interfacial N layer were achieved. It turns out that exist at the NC surface, which is well in accordance to the optimum value of the bulk interface. These results strongly support our recently suggested explanation for the N-blueshift that is based on an increased NC band gap by the influence of interfacial N on the polarity of the surface terminating groups.
2 More- Received 27 May 2010
DOI:https://doi.org/10.1103/PhysRevB.82.195401
©2010 American Physical Society