Ultrathin GaN nanowires: Electronic, thermal, and thermoelectric properties

A. H. Davoody, E. B. Ramayya, L. N. Maurer, and I. Knezevic
Phys. Rev. B 89, 115313 – Published 19 March 2014

Abstract

We present a comprehensive computational study of the electronic, thermal, and thermoelectric (TE) properties of gallium nitride nanowires (NWs) over a wide range of thicknesses (3–9 nm), doping densities (10181020 cm3), and temperatures (300–1000 K). We calculate the low-field electron mobility based on ensemble Monte Carlo transport simulation coupled with a self-consistent solution of the Poisson and Schrödinger equations. We use the relaxation-time approximation and a Poisson-Schrödinger solver to calculate the electron Seebeck coefficient and thermal conductivity. Lattice thermal conductivity is calculated using a phonon ensemble Monte Carlo simulation, with a real-space rough surface described by a Gaussian autocorrelation function. Throughout the temperature range, the Seebeck coefficient increases while the lattice thermal conductivity decreases with decreasing wire cross section, both boding well for TE applications of thin GaN NWs. However, at room temperature these benefits are eventually overcome by the detrimental effect of surface roughness scattering on the electron mobility in very thin NWs. The highest room-temperature ZT of 0.2 is achieved for 4-nm-thick NWs, while further downscaling degrades it. In contrast, at 1000 K, the electron mobility varies weakly with the NW thickness owing to the dominance of polar optical phonon scattering and multiple subbands contributing to transport, so ZT increases with increasing confinement, and reaches 0.8 for optimally doped 3-nm-thick NWs. The ZT of GaN NWs increases with increasing temperature beyond 1000 K, which further emphasizes their suitability for high-temperature TE applications.

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  • Received 16 July 2013
  • Revised 6 February 2014

DOI:https://doi.org/10.1103/PhysRevB.89.115313

©2014 American Physical Society

Authors & Affiliations

A. H. Davoody*, E. B. Ramayya, L. N. Maurer, and I. Knezevic

  • Department of Electrical and Computer Engineering, University of Wisconsin–Madison, Madison, Wisconsin 53706-1691, USA

  • *davoody@wisc.edu
  • Currently with Intel Corporation, Hillsboro, OR.
  • knezevic@engr.wisc.edu

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Vol. 89, Iss. 11 — 15 March 2014

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