Study on High Thermal Conductive BN/Epoxy Resin Composites

Hui Wang; Peng Chen; Jian Sun; Xiao Jun Kuang; Zhen Kun Yao

doi:10.4028/www.scientific.net/AMM.105-107.1751

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 105-107Study on High Thermal Conductive BN/Epoxy Resin...

Study on High Thermal Conductive BN/Epoxy Resin Composites

Abstract:

In contemporary electronic technology era, the volume of electronic equipment and printed circuit board reduced so dramatically that the requirements of heat dissipation and insulation increase thereafter. In this research, γ-aminopropyltriethoxysilane (KH550)-treated boron nitride (BN) powder was used as a filler to modify epoxy composites. Effects of the BN particle size and concentration on the thermal conductivity of composites were investigated. SEM image showed the treated BN filler dispersed well in the composite matrix. Moreover, the thermal conductivity was enhanced as the BN concentration was increased. Similar phenomenon was also observed when the filler particle size was reduced. Results indicated that with increasing amount of BN addition, the composites’ thermal conductivity showed a nearly linear increase. When the mass fraction of BN was 30% and its particle size was 220 nm, the thermal conductivity reached 3.4 W/(m•k), which was 17 times as high as that of pure EP resin.

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Periodical:

Applied Mechanics and Materials (Volumes 105-107)

Pages:

1751-1754

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.105-107.1751

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Cite this paper

Online since:

September 2011

Authors:

Hui Wang, Peng Chen, Jian Sun, Xiao Jun Kuang, Zhen Kun Yao

Keywords:

Boron Nitride, EP, Thermal Conductivity (TC)

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